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Dimensity 9400 Could Give the Snapdragon 8 Gen 4 a Hard Time as More Details About the Chipset Surface
21.03.2024 - 16:59 / wccftech.com / Furqan Shahid
The Dimensity 9400 is going to go official later this year, and it appears that MediaTek is planning on taking the fight to Snapdragon 8 Gen 4 with some really compelling specs and possibly really powerful CPU cores.
MediaTek Dimensity 9400 will use no efficiency cores, and will be built using the 3nm fabrication process
According to information from Digital Chat Station, the MediaTek Dimensity 9400 is not going to come with any little/efficiency cores at all. Instead, it will be using Cortex-X5, Cortex-X4, and Cortex-A7xx cores. At the time, the source did not tell us about the CPU layout, but it could focus on a single Cortex-X5 core, three Cortex-X4 cores, and four Cortex-A7xxx cores, and this combination is going to make the CPU very compelling.
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If this report is true, then the Dimensity 9400 is going to be one of the most powerful CPUs in the market. However, it will come with its own set of challenges in the form of thermal issues that the company could run into. Not only that, the processor will also have to face a lot of challenges from the Snapdragon 8 Gen 4, which is getting close to its final stages, whereas the MediaTek chip is going to debut sometime in October.
Aside from that, the source also talks about how the company is going to release the Dimensity 9300+, which should deliver better performance than its predecessor, but what I am more excited about is the Dimensity 9400. Sadly, there are not a lot of details available at the moment, but we do know that the new chipset will be fabricated using the 3nm TSMC process, and I can expect the same when it comes to the Snapdragon 8 Gen 4. Needless to say, the chip war is hitting up once again and the competition is looking forward to making sure that they have the best chip in for the fight.
Going forward, you can expect a lot more details about the MediaTek Dimensity 9400, and I am really hoping that this time around, the chipset will make an international debut in more devices than the predecessor did.
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