MediaTek plans to go all out with the upcoming Dimensity 9400 in sheer size, as a fresh rumor floating around claims that the SoC will flaunt the biggest die size to be used in a smartphone platform ever. Thanks to this size increase, the Dimensity 9400 is also said to sport in excess of 30 billion transistors, making the count 32 percent higher than the 22.7 billion transistors found on the Dimensity 9300.
Dimensity 9400’s GPU details also mention a 20 percent bump in performance and efficiency; a bigger die size will lead to increased cost
Coming to the die size first, @faridofanani96 and @negativeonehero have shared on X that the Dimensity 9400 will measure 150mm² and for reference, NVIDIA’s GT 1030 measures 74mm², with the GTX 1650 sporting a die size of 200mm². In short, we are getting a smartphone chipset that has a physical size more or less equivalent to a desktop graphics processor, which is just remarkable. The obvious benefits of using a bigger die size are that companies like MediaTek can cram more transistors, plus a higher cache and bigger Neural Processing Unit.
Related Story NVIDIA’s Next-Gen RTX & AI GPU IP Incorporated Within Mediatek’s Upcoming Dimensity SOCs
As for the drawbacks, the obvious one is cost, and paired with TSMC’s 3nm ‘N3E’ process that will reportedly be leveraged to mass the Dimensity 9400, we could be looking at MediaTek’s most expensive smartphone SoC yet. Fortunately, there are other advantages too, such as the improved performance and efficiency of the GPU, as the rumor claims that we could witness a 20 percent uplift compared to the previous generation, possibly beating the Snapdragon 8 Gen 4 in the process.
Earlier, we reported that the Dimensity 9400 was going through some overheating problems caused by the ARM’s Cortex-X5, not to mention a rapid increase in power consumption. It is possible that MediaTek has addressed this issue by increasing the die size of the SoC, but there is no confirmation at this time. Hopefully, we witness some stiff competition later this year, and as always, we will provide comparisons soon, so stay tuned.
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The Dimensity 9400 is scheduled to be announced later this year, and one of the most significant differences between it and chipsets like the Snapdragon 8 Gen 4 and A17 Pro is that MediaTek will not rely on custom cores for its upcoming SoC. Instead, ARM’s current CPU designs will be utilized, which might give an impression that the Dimensity 9400 is at a distinct disadvantage. However, one tipster claims that MediaTek and ARM are collaborating to use the latter’s ‘BlackHawk’ architecture in the upcoming silicon, potentially delivering better Instructions Per Clock (IPC) performance than competing current-generation chips.
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