Snapdragon X Elite Package Power Can Touch Nearly 100W, Making It More Than Twice The Amount Compared To Apple’s M3 Pro

The Pura 70 flagship series officially launched by Huawei also sports the company’s new Kirin 9010, a 12-core SoC that delivers a slew of improvements over its predecessor, the Kirin 9000S from last year. However, regarding lithography, the Kirin 9010 and Kirin 9000S are pretty much identical, with a teardown revealing that Huawei stuck with SMIC’s 7nm process to mass produce its latest SoC.

Qualcomm is expected to officially unveil the Snapdragon 8 Gen 4 in October this year, so it is no surprise that the flagship’s engineering sample is being thoroughly tested and benchmarked to iron out the problems before commercial units are sent to the company’s phone partners. However, early results show that the chipset’s performance is beyond disappointing, with the performance cores said to be running at a significantly lower resolution than what previous reports suggested.

Huawei achieved another milestone with its Pura 70 series launch and that is sourcing 90 percent of smartphone components from Chinese suppliers. With the U.S. export control barring foreign companies from shipping parts to the company to use in various products, Huawei was adamant about cutting off overseas manufacturers and relying on local firms to get the job done. So far, the progress has been impressive, and only a few components remain to completely eliminate dependency on supply chain partners outside of China.

The Dimensity 9400 is scheduled to be announced later this year, and one of the most significant differences between it and chipsets like the Snapdragon 8 Gen 4 and A17 Pro is that MediaTek will not rely on custom cores for its upcoming SoC. Instead, ARM’s current CPU designs will be utilized, which might give an impression that the Dimensity 9400 is at a distinct disadvantage. However, one tipster claims that MediaTek and ARM are collaborating to use the latter’s ‘BlackHawk’ architecture in the upcoming silicon, potentially delivering better Instructions Per Clock (IPC) performance than competing current-generation chips.

Huawei was previously rumored to be developing an Apple M1 competitor to take that ARM-based chipset market share away from the company. However, according to the latest information, the Chinese firm is using the Taishan V130 architecture to mass produce a silicon that can come close to the M3’s multi-core performance. It appears that Qualcomm’s Snapdragon X Elite is not the only one trying to carve out a piece of the pie.

The Snapdragon X Elite performance numbers that nearly everyone has seen would likely present an impression that Qualcomm has finally developed a capable ARM-based SoC that delivers some much-needed competition to Apple Silicon. Unfortunately, that would have been the case if the San Diego chip giant had not allegedly manipulated benchmarks. One report says that the benchmark claims are impossible to recreate for Qualcomm’s partners that will eventually use the Snapdragon X Elite in various notebook models.

Qualcomm officially took the wraps off the Snapdragon X Elite, revealing that there was not one but three SKUs that will be found in various premium notebooks, with the fourth one being the less powerful Snapdragon X Plus. The SoC was recently benchmarked in the upcoming Microsoft Surface Laptop 6, operating at 4.00GHz, suggesting that it is one of the two versions that supports boost clock technology. The scores show that Qualcomm’s latest and greatest silicon continues to outpace Apple’s M3, but it has yet to overtake the higher-end chipsets.

A few hours have passed since Huawei officially announced the Pura 70 series of flagships, which boast the upgraded Kirin 9010 chipset, along with improvements in various areas. As you would expect, in the blink of an eye, the premium Pura 70 Pro and the Pura 70 Ultra sold out in just one minute when sales went live on the Chinese phone maker’s online store. This might showcase evidence that the latest models will ship in droves and that Huawei’s competition has much to worry about.

The Galaxy S24 Ultra improves upon its predecessor, the Galaxy S23 Ultra, in every possible way, and for those looking for a premium flagship on Amazon, the 512GB storage version can be yours for $200 less. Yes, you read that correctly; the current retail price for the unlocked variant of Samsung’s top-end offering is available for $1,219.99. Bear in mind that the cost of a base model that ships with 256GB of onboard memory launched for $1,299.99, so this is practically a steal if you want one of the best Android handsets at a lower price.

A few of Qualcomm’s phone partners always make an appearance at the company’s annual Snapdragon Summit to reveal which of their devices will be powered by the next flagship chipset. Historically, Xiaomi has always been the first to announce its premium offering for next year, and according to a tipster, the Chinese manufacturer will retain those exclusive rights when it unveils its first Snapdragon 8 Gen 4 smartphone. However, showcasing a launch is one thing, and making it officially available to purchase is another.

The Snapdragon X Plus is Qualcomm’s less powerful version of the Snapdragon X Elite that will power less capable notebooks, but on paper, its specifications are quite promising. According to a Geekbench 6 leak, in the ‘ML’ benchmark, we spotted that the upcoming SoC will sport a 10-core CPU cluster, making it two cores less than the Snapdragon X Elite, along with other details, so let us check them out here.

Advanced Semiconductor Engineering, or ASE, has reportedly won an exclusive order from Apple to supply two SiPs, or ‘system in a package’ for the upcoming iPhone 16 series. These chips will serve to replace both the volume and power buttons on the upcoming handsets, presenting capacitive buttons that will deliver extra functionality.