Intel Adds 14A Process Node To Its Roadmap, Updates To 18A & Intel 3 Nodes Unveiled at IFS Direct

21.02.2024 - 18:53 / wccftech.com / Sam Altman / Hassan Mujtaba

Intel has unveiled its brand new roadmap for its next-gen process nodes at IFS Direct which now includes 14A & updates on already announced nodes.

Intel 2027 Process Roadmap Lays Out 14A, 14A-E, 18A-P, 3E & 3-PT Nodes For Next-Gen Semiconductors

Press Release: Intel Corp. (INTC) today launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade.

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The company also highlighted customer momentum and support from ecosystem partners – including Synopsys, Cadence, Siemens, and Ansys – who outlined their readiness to accelerate Intel Foundry customers’ chip designs with tools, design flows and IP portfolios validated for Intel’s advanced packaging, and Intel 18A process technologies.

The announcements were made at Intel’s first Foundry event, Foundry Direct Connect, where the company gathered customers, ecosystem companies, and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman, and others.

The highlights of these announcements are listed below:

• Intel Foundry launches as the world’s first systems foundry for the AI era, delivering leadership in technology, resiliency, and sustainability.
• Intel Foundry unveils new roadmap featuring 14A process technology, specialized node evolutions and new Foundry Advanced System Assembly and Test (ASAT) capabilities to help customers realize their AI ambitions.
• Intel Foundry announces design win: Microsoft CEO Satya Nadella shares that Microsoft has chosen a chip design it plans to produce on the 18A process.
• Ecosystem partners including Synopsys, Cadence, Siemens, and Ansys announce validated tools, design flows, and intellectual property (IP) portfolios ready to enable customer designs.

[Editor's Note] With its latest process node roadmap, Intel is unveiling new additions to its process roadmap which now include sub-variants of each node with the "E", "P" and "T" suffixes. All these suffixes represent a certain extension to either feature set, performance, or packaging technology. The "P" for the likes of 18A-P and 3-PT represents higher performance with up to 10% gains over its standard variant while the "T" represents the use of TSV's or Through-Silicon Vias which will be part of the 3D Foveros Direct technology. The "E" sub-variants represent an extension to the classic node which will target specific customers.

Additionally, the company also unveiled that it