Huawei Intros 5nm Kirin 9006C 8-Core SOC In Qingyun L540 Laptops

Chinese Mini PC manufacturer, FEVM, has launched its socketed design that features the LGA 1700 socket and supports discrete GPUs in a compact form factor.

Huawei’s comeback has been noticed by industry insiders, and most notably, its competitors, as the Mate 60 flagship series and the Kirin 9000S SoC pairing created a sales storm in China, garnering immense popularity that allowed the company to post an incredible 90 percent growth in October. However, Huawei’s resurgence might not be as meteoric as one previously expected because the latest data reveals that Apple has three iPhone models that are in the top 5 best-selling spot for the region.

A new leak provides evidence that Huawei will not be limiting itself to the Kirin 9000S and intends to bring new chipsets to the more affordable options as it attempts to regain control of a market it was dominating before trade sanctions took their hold in 2019. The former Chinese giant is said to be working on the Kirin 8000, with the silicon expected to debut in a non-flagship model.

AMD & Intel motherboard partners are aiming for a Q3 2024 launch for the next-gen 700-series "AM5" & 800-series "LGA 1851" platforms.

Huawei has remained mum on the subject of building its own fabrication plants, and that is likely to avoid further trade restrictions from the U.S. However, a recent patent filing provides evidence that the former Chinese giant is going the extra mile to reduce dependency on foreign companies. The patent application date is June 2022, describing a process for improving wafer alignment and efficiency. It is titled ‘Wafer Processing Device and Wafer Processing Method’ and provides some evidence that Huawei wishes to build its chip plants, which can mean it may want to rid itself of SMIC too.

Intel's Gaudi 3 AI accelerator reportedly employs the TSMC 5nm process and is expected to compete with NVIDIA H100 & AMD MI300X.

A Chinese laptop maker has put together a unique configuration that offers up to a 64 Core AMD EPYC CPU, NVIDIA RTX 40 Desktop GPUs & liquid cooling.

Huawei is working on a new smartphone launch, and according to the detailed specifications shared by a tipster, it will be powered by a new chipset, dubbed the Kirin ‘K9.’ Whether or not it is a rebranded version of the Kirin 9000S, we discuss further in our findings, so read on.

After its debut in Vivo's home market, the company's camera-centric flagships have now been announced for the global market. This would mainly include Europe and Southeast Asian markets, where the company has a noticeable presence. Vivo has announced both its X100 Pro and the X100 for global markets, and they both pack in some interesting specifications. Both smartphones will compete with the likes of Samsung's Galaxy S23 series and the upcoming Galaxy S24 series, which is set to debut in January 2024.

If you want your shiny new Intel Core UItra laptop to come with an equally shiny Arc Graphics badge, then you're going to need to make sure you have at least 16GB of memory inside your machine and that it's configured in dual-channel mode, too.

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Intel has taken the wraps off its new Meteor Lake-based Core Ultra laptop CPUs, and it's aiming these low-power chips squarely at my favourite AMD chip of all time—the Ryzen 7 7840U. That's the similarly low-power Zen 4 processor at the heart of the latest Framework 13 mainboard, but also every single non-Valve handheld gaming PC that was released this year.